Title: A Parylene temporary packaging technique for MEMS wafer handling
Authors: Wen, Lianggong ×
Wouters, Kristof
Ceyssens, Frederik
Witvrouw, Ann
Puers, Bob #
Issue Date: Apr-2012
Publisher: Elsevier Science Pub. Co.
Series Title: Sensors and Actuators A, Physical vol:186 pages:289-297
Abstract: This paper presents a wafer-level temporary packaging technique utilizing a chemical vapor deposited (CVD) poly-(p-xylylene) polymer Parylene film, and oxygen plasma etching. As a test case, released, unpackaged accelerometers fabricated in a SiGe MEMS above IC technology were coated with two different types of Parylene, Parylene N and Parylene C respectively, as dicing protection. Oxygen plasma is used to etch the Parylene and to release the freestanding structures after dicing. The final releasing results are compared, and Parylene N turns out to be the best material for temporary packaging. The devices are electrostatically characterized after the Parylene coating. The results demonstrate the feasibility of using Parylene as a temporary protective material for both metal and semiconductor MEMS devices, to prevent any damage during subsequent wafer handling and dicing.
ISSN: 0924-4247
Publication status: published
KU Leuven publication type: IT
Appears in Collections:ESAT - MICAS, Microelectronics and Sensors
Production Engineering, Machine Design and Automation (PMA) Section
× corresponding author
# (joint) last author

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