Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV vol:5716 pages:26-35
Proceedings of The Society of Photo-optical Instrumentation Engineering (SPIE)
Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV San Jose, CA, JAN 24-25, 2005
Zero-level packaging, i.e. the encapsulation of the MEMS device at wafer level, is an essential technique for MEMS miniaturization and cost reduction. A large number of different capping and sealing materials and techniques can be used. However, the testing and qualification of this type of packaging of MEMS devices requires special techniques. A number of conventional and new characterization techniques for mechanical and hermeticity testing are presented, as well as an overview about outgasing measurements and reliability testing.