Title: Characterization of (near) hermetic zero-level packages for MEMS
Authors: De Moor, P
Baert, Tine
De Wolf, Ingrid
Jourdain, A
Tilmans, HAC
Witvrouw, A
Van Hoof, C #
Issue Date: 2005
Publisher: Spie-int soc optical engineering
Host Document: Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV vol:5716 pages:26-35
Series Title: Proceedings of The Society of Photo-optical Instrumentation Engineering (SPIE)
Conference: Conference on Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV San Jose, CA, JAN 24-25, 2005
Abstract: Zero-level packaging, i.e. the encapsulation of the MEMS device at wafer level, is an essential technique for MEMS miniaturization and cost reduction. A large number of different capping and sealing materials and techniques can be used. However, the testing and qualification of this type of packaging of MEMS devices requires special techniques. A number of conventional and new characterization techniques for mechanical and hermeticity testing are presented, as well as an overview about outgasing measurements and reliability testing.
ISBN: 0-8194-5690-X
ISSN: 0277-786X
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Department of Materials Engineering - miscellaneous
# (joint) last author

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