Title: Theoretical and experimental Raman spectroscopy study of mechanical stress induced by electronic packaging
Authors: Chen, J ×
De Wolf, Ingrid #
Issue Date: Sep-2005
Publisher: Institute of Electrical and Electronics Engineers
Series Title: IEEE Transactions on Components and Packaging Technologies vol:28 issue:3 pages:484-492
Conference: 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Las Vegas, NV, JUN 01-04, 2004
Abstract: The mechanical stress induced in Si chips by the packaging process (effect of die attach, flip chip bumping, etc.) is measured by micro-Raman spectroscopy. The measurements are performed on the (110) cross-section surface of the polished samples. This study shows that the current Raman formula for top-surface measurements cannot be used for cross-section measurements due to the anisotropic property of Si. The new formula for cross-section measurements is introduced in this paper. The experimental results are compared to finite element simulations. The Raman results correlate very well with the FE calculations. It shows that micro-Raman spectroscopy is a very interesting technique to study packaging induced stress in Si chips and to validate finite element calculations.
ISSN: 1521-3331
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Department of Materials Engineering - miscellaneous
× corresponding author
# (joint) last author

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