Title: Numerical analysis of the process-induced stresses in silicon microstructures: application to micromachined cantilever
Authors: Senez, V ×
Hoffmann, T
Armigliato, A
De Wolf, Ingrid #
Issue Date: Feb-2006
Publisher: IOP Pub.
Series Title: Smart Materials and Structures vol:15 issue:1 pages:S47-S56
Conference: SPIE International Symposium on Microlectronics, MEMS and Nanotechnology location:Perth, AUSTRALIA date:Dec 2003
Abstract: A technology computer aided design homemade tool, IMPACT, is described. The mechanical models and the numerical implementation are presented. Details are given about the methodology to calibrate and validate the implementation. This tool is used for the analysis of the processing of a micromachined cantilever. The originality of the study lies in (i) the capability to Simulate almost all the Sources of stress taking into account the complex rheological behaviours of the materials, (ii) the experimental determination of the mechanical properties of various thin film materials, and (iii) the validation of the calculations by direct comparisons with the measured deformations of the cantilever.
ISSN: 0964-1726
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Department of Materials Engineering - miscellaneous
× corresponding author
# (joint) last author

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