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Title: A novel resist and post-etch residue removal process using ozonated chemistry
Authors: De Gendt, Stefan ×
Snee, P.
Cornelissen, I.
Lux, M.
Vos, R.
Mertens, P.W.
Knotter, D.M.
Meuris, M.M.
Heyns, Marc #
Issue Date: Jan-1999
Publisher: Trans tech-scitec publications ltd
Series Title: Solid state phenomena vol:65-6 pages:165-168
Abstract: A novel, environmentally friendly process is successfully applied for the removal of photoresist and organic post-etch residues from silicon surfaces. The improved performance of the moist ozone gasphase process over traditional immersion based ozone processes is due to boundary control processing, i.e. enhanced reactive ozone availability near the wafer surface. Additionally, OH radical scavengers chemically enhance the process efficiency even further.
ISSN: 1012-0394
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Molecular Design and Synthesis
Department of Architecture - miscellaneous
Department of Materials Engineering - miscellaneous
× corresponding author
# (joint) last author

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