Title: Polymer filling of silicon trenches for 3D through silicon vias applications
Authors: Duval, Fabrice ×
Okoro, Chukwudi
Civale, Yann
Soussan, Philippe
Beyne, Eric #
Issue Date: Jun-2011
Publisher: Institute of Electrical and Electronics Engineers
Series Title: IEEE Transactions on Components, Packaging and Manufacturing Technology vol:1 issue:6 pages:825-832
ISSN: 2156-3950
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Production Engineering, Machine Design and Automation (PMA) Section
× corresponding author
# (joint) last author

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