Title: A novel Cu-Cu bonding technique: the insertion bonding approach
Authors: Okoro, Chukwudi ×
Limaye, Paresh
Agarwal, Rahul
Vandevelde, Bart
Beyne, Eric
Vandepitte, Dirk #
Issue Date: Dec-2011
Publisher: Institute of Electrical and Electronics Engineers
Series Title: IEEE Transactions on Components, Packaging and Manufacturing Technology vol:1 issue:12 pages:1885-1894
ISSN: 2156-3950
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Production Engineering, Machine Design and Automation (PMA) Section
× corresponding author
# (joint) last author

Files in This Item:
File Description Status SizeFormat
Novel Cu-Cu Bonding Technique_The Insertion Bonding Approach.pdf Published 1025KbAdobe PDFView/Open Request a copy

These files are only available to some KU Leuven Association staff members


All items in Lirias are protected by copyright, with all rights reserved.

© Web of science