Title: Interconnect reliability – A study of the effect of dimensional and porosity scaling
Authors: Croes, Kristof ×
Wilson, Chris
Lofrano, Melina
Beyer, Gerald
Tokei, Zsolt #
Issue Date: May-2011
Publisher: North-Holland
Series Title: Microelectronic Engineering vol:88 issue:5 pages:614-619
ISSN: 0167-9317
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Non-KU Leuven Association publications
× corresponding author
# (joint) last author

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