Title: Temperature-dependent modeling and characterization of Through Silicon Via (TSV) capacitance
Authors: Katti, Guruprasad ×
Stucchi, Michele
Velenis, Dimitrios
Soree, Bart
De Meyer, Kristin
Dehaene, Wim #
Issue Date: Apr-2011
Publisher: Institute of Electrical and Electronics Engineers
Series Title: IEEE Electron Device Letters vol:32 issue:4 pages:563-565
ISSN: 0741-3106
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Electrical Engineering - miscellaneous
Associated Section of ESAT - INSYS, Integrated Systems
ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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