ITEM METADATA RECORD
Title: Raman spectroscopy analysis of mechanical stress near Cu-TSVs
Authors: De Wolf, Ingrid
Issue Date: 2011
Host Document: STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: INTERNATIONAL WORKSHOP ON STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS vol:1378 pages:138-149
Conference: Stress Management for 3D ICs Using Through Silicon Vias location:Dresden Germany date:03/16/2010
ISBN: 978-0-7354-0938-5
ISSN: 0094-243X
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Department of Materials Engineering - miscellaneous

Files in This Item:

There are no files associated with this item.

Request a copy

 




All items in Lirias are protected by copyright, with all rights reserved.

© Web of science