Title: Impact of “terminal effect” on Cu electrochemical deposition: filling capability for different metallization options
Authors: Armini, Silvia ×
Tokei, Zsolt
Volders, Henny
El-Mekki, Zaid
Radisic, Alex
Beyer, Gerald
Ruythooren, Wouter
Vereecken, Philippe #
Issue Date: May-2011
Publisher: North-Holland
Series Title: Microelectronic Engineering vol:88 issue:5 pages:754-759
ISSN: 0167-9317
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Non-KU Leuven Association publications
× corresponding author
# (joint) last author

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