|ITEM METADATA RECORD
|Title: ||Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers|
|Authors: ||Wilson, Chris ×|
Beyer, Gerald #
|Issue Date: ||May-2011 |
|Series Title: ||Microelectronic Engineering vol:88 issue:5 pages:656-660|
|Publication status: ||published|
|KU Leuven publication type: ||IT|
|Appears in Collections:||Non-KU Leuven Association publications|
× corresponding author|
# (joint) last author|
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