Title: Technology assessment of through-silicon via by using C-V and C-t Measurements
Authors: Katti, Guruprasad ×
Stucchi, Michele
Velenis, Dimitrios
Thangaraju, Sarasvathi
De Meyer, Kristin
Dehaene, Wim
Beyne, Eric #
Issue Date: Jul-2011
Publisher: Institute of Electrical and Electronics Engineers
Series Title: IEEE Electron Device Letters vol:32 issue:7 pages:946-948
ISSN: 0741-3106
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Electrical Engineering - miscellaneous
Associated Section of ESAT - INSYS, Integrated Systems
ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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