Title: A Comprehensive LER-Aware TDDB Lifetime Model for Advanced Cu Interconnects
Authors: Stucchi, Michele ×
Roussel, Philippe J
Toekei, Zsolt
Demuynck, Steven
Groeseneken, Guido #
Issue Date: Jun-2011
Publisher: Institute of Electrical and Electronics Engineers
Series Title: IEEE Transactions on Device and Materials Reliability vol:11 issue:2 pages:278-289
Abstract: A time-dependent dielectric breakdown (TDDB) lifetime model predicting the impact of line-edge roughness (LER) on Cu interconnect reliability is proposed. The structure, validity, and accuracy of the model are evaluated and discussed. The model is applied to an interconnect scaling scenario that includes conventional patterning and spacer-defined patterning of nanometer-scale Cu wires. LER-aware TDDB lifetime predictions are obtained from the model, and consequent recommendations on how to improve the TDDB lifetime of future interconnects are derived.
ISSN: 1530-4388
Publication status: published
KU Leuven publication type: IT
Appears in Collections:ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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