Particles on Surfaces 8: Detection, Adhesion and Removal pages:255-270
8th International Symposium on Particles on Surfaces location:Providence, RI date:24-26 June 2002
Sub-micrometer particles on a wafer surface can have a detrimental effect on the yield in semiconductor device manufacturing and with shrinking dimensions of IC structures, this effect becomes more and more important. The critical particle sizes as set by the ITRS roadmap indicate that for sub-100-nm technologies, particles on the order of a few tens of nanometers will have to be removed. Therefore, there is a growing need to optimise the surface cleaning in order to control the density of these particles. In this paper, an overview is given of the current state-of-the-art in wafer cleaning technology and various approaches to achieve a good removal of all kinds of particles on various substrates are presented.