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Title: Outgassing study of thin films used for poly-SiGe based vacuum packaging of MEMS
Authors: Wang, Bo ×
Tanaka, S.
Guo, B.
Vereecke, G.
Severi, S.
Witvrouw, Ann
Wevers, Martine
De Wolf, Ingrid #
Issue Date: Sep-2011
Publisher: Pergamon-elsevier science ltd
Series Title: Microelectronics Reliability vol:51 issue:9-11 pages:1878-1881
Abstract: Thermal desorption spectroscopy (TDS) was used to study outgassing from polycrystalline SiGe (poly-SiGe), SiC and SiO2 films used for poly-SiGe-based MEMS thin film vacuum package technology. Primary desorption products were found to be H-2. H2O and CO2. The CO2 outgassing could be correlated with CF4 plasma interface cleaning used for thick SiGe PECVD, which can leave carbon at the CF4-plasma-cleaned interface. (C) 2011 Elsevier Ltd. All rights reserved.
URI: 
ISSN: 0026-2714
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Department of Materials Engineering - miscellaneous
Mechanical Metallurgy Section (-)
× corresponding author
# (joint) last author

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