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Title: Out-of-Plane, High strength, Polymer Microneedles for Transdermal Drug Delivery
Authors: Chaudri, Buddha Paul
Ceyssens, Frederik
Neves, HP
La Manna, A
Van Hoof, Chris
Puers, Bob
Issue Date: Sep-2011
Host Document: 2011 ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY (EMBC) pages:3680-3683
Conference: 33rd Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC ’11) edition:33 location:Boston date:30 august - 3 september 2011
Abstract: XThis paper reports on the high strength of highaspect
ratio (> 50) hollow, polymer microneedles fabricated
out-of-plane using a fairly repeatable fabrication process.
Further, these microneedle tips were sharpened by a molding
principle, with a simple anisotropic etch of silicon wafer. Also,
an enhanced elegant process was explored to incorporate the
mounting of the microneedle onto a platform without using any
additional material, such that the bore of the microneedle is
continuous with the bore of the platform in order to facilitate
microfluidic delivery through the hollow needles. The high
aspect ratio microneedles undergo failure at the critical load of
around 4 N, while the insertion force for such a needle into agar
gel, which is a fairly good equivalent of the human skin due to
its inherent visco-elastic properties, is 7 mN, which translates
into a safety factor (ratio of critical loading force to the
maximum applied force) of greater than 500 thus, making it
adequately strong for skin penetration.
ISBN: 978-1-4244-4122-8
Publication status: published
KU Leuven publication type: IC
Appears in Collections:ESAT - MICAS, Microelectronics and Sensors
Associated Section of ESAT - INSYS, Integrated Systems

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