Title: A Parylene Temporary Packaging Technique for MEMS Wafer Handling
Authors: Wen, Lianggong ×
Wouters, Kristof
Ceyssens, Frederik
Witvrouw, Ann
Puers, Bob #
Issue Date: Sep-2011
Host Document: Procedia Engineering vol:25 pages:1501-1504
Conference: Eurosensors edition:25 location:Athens, Greece date:Sept 4-7 2011
Abstract: This paper presents a wafer-level temporary packaging technique utilizing a chemical vapor deposited (CVD) poly-(p-xylylene) polymer Parylene film, and oxygen plasma etching. As a test case, released, unpackaged accelerometers made in a SiGe MEMS above IC technology were coated with two different types of Parylene, Parylene N and Parylene C respectively, as a dicing protection. An oxygen plasma is used to etch the Parylene and to release the freestanding structures after dicing. The final releasing results are compared, and Parylene N turns out to be the best material for temporary packaging. The devices are electrostatically characterized after the Parylene coating. The results demonstrate the feasibility of using Parylene as a temporary protective material for both metal and semiconductor MEM devices, to prevent any damage during subsequent wafer handling and dicing.
ISSN: 1877-7058
Publication status: published
KU Leuven publication type: IC
Appears in Collections:ESAT - MICAS, Microelectronics and Sensors
Department of Materials Engineering - miscellaneous
× corresponding author
# (joint) last author

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