Title: Poly-SiGe-based MEMS thin film encapsulation
Authors: Guo, Bin ×
Wang, Bo
Wen, Lianggong
Philippe, Helin
Claes, Gert
De Coster, J.
Du Bois, B.
Verbist, A.
Van Hoof, R.
Vereecke, G.
Haspeslagh, L.
A C tilmans, H.
Decoutere, S.
Osman, H.
Puers, Robert
De Wolf, Ingrid
Tanaka, S.
Severi, S.
Witvrouw, Ann
Issue Date: Feb-2012
Publisher: Institute of Electrical and Electronics Engineers
Series Title: Journal of Microelectromechanical Systems vol:21 issue:1 pages:110-120
ISSN: 1057-7157
Publication status: published
KU Leuven publication type: IT
Appears in Collections:ESAT - MICAS, Microelectronics and Sensors
Physics and Astronomy - miscellaneous
Department of Materials Engineering - miscellaneous
Structural Composites and Alloys, Integrity and Nondestructive Testing
× corresponding author

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