Single chemistry cleaning solution for advanced wafer cleaning
Vos, R. Doll, O. Fester, A. Kolbesen, B.O. Lux, M. Kenis, K Onsia, B. De Gendt, Stefan Schellkes, E. Hatcher, Z. Mertens, P. Heyns, Marc #
Scitec publications ltd
Ultra clean processing of silicon surfaces 2000 vol:76-77 pages:119-122
In this work, a high performance APM cleaning process is developed. Complexing agents are added to the APM mixture in order to improve its performance against metallic contamination introduced either from the fresh chemicals or during the cleaning process. Complexing agents are found to be beneficial (i) to stabilize the APM mixture for the metal catalyzed decomposition reaction of the peroxide, (ii) to prevent the outplating of metals from a contaminated cleaning mixture and (iii) to increase the removal of metallic contamination from the wafer surface.