Title: Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu
Authors: Okoro, Chukwudi ×
Labie, Riet
Vanstreels, Kris
Franquet, Alexis
Gonzalez, Mario
Vandevelde, Bart
Beyne, Eric
Vandepitte, Dirk
Verlinden, Bert #
Issue Date: Jun-2011
Publisher: Springer Science + Business Media
Series Title: Journal of Materials Science vol:46 issue:11 pages:3868-3882
Abstract: In this study, the role of electrodeposition chemistry on thermo-mechanical behavior of different Cu-films is examined. For this study, three different Cu electrodeposition chemistries were analyzed using Time-of-Flight Secondary Ion Mass Spectroscopy (TOF-SIMS), Focused Ion Beam (FIB), Laser Scanning method, Electron Backscattered Diffraction, and the Nano-indentation techniques. It is found that the level of impurity in Cu-films, resulting from the used electrodeposition additives, has a significant impact on their microstructural and thermo-mechanical behavior. Cu-films having high impurity content showed residual stress levels that are three times higher than the less impure Cu-films. This implies that the use of such impure electrodeposition chemistry for the filling of TSVs will result in high residual stresses in the Cu-TSV, thus inducing higher stresses in Si, which could be a reliability concern. Therefore, the choice of the used electrodeposition chemistry for the filling of TSVs should not be limited only to the achievement of a void free Cu-TSV, as consideration ought to be given to their thermo-mechanical response.
ISSN: 0022-2461
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Physical Metallurgy and Materials Engineering Section (-)
Production Engineering, Machine Design and Automation (PMA) Section
× corresponding author
# (joint) last author

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