Title: Capacitance reduction technique for through silicon via (TSV) in p-Si substrate
Authors: Katti, Guruprasad ×
Stucchi, Michele
De Meyer, Kristin
Dehaene, Wim #
Issue Date: Jun-2010
Publisher: IEEE
Series Title: IEEE Electron Device Letters vol:31 issue:6 pages:549-551
ISSN: 0741-3106
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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