ITEM METADATA RECORD
Title: Cu/Sn microbumps interconnect for 3D TSV chip stacking
Authors: Agarwal, Rahul
Zhang, Wenqi
Limaye, Paresh
Labie, Riet
Dimcic, Biljana
Phommahaxay, Alain
Soussan, Philippe #
Issue Date: 2010
Host Document: Proceedings of the IEEE 60th Electronic Components and Technology Conference - ECTC pages:858-863
Conference: IEEE 60th Electronic Components and Technology Conference - ECTC location:Las Vegas, NV USA date:1-jun-2010
ISBN: 978-1-4244-6412-8
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Non-KU Leuven Association publications
# (joint) last author

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