|ITEM METADATA RECORD
|Title: ||Analysis and characterization of a mechanical sensor to monitor stress in interconnect features|
|Authors: ||Wilson, Chris ×|
O'Neill, Anthony #
|Issue Date: ||Oct-2010 |
|Series Title: ||Thin Solid Films vol:519 issue:1 pages:443-449|
|Publication status: ||published|
|KU Leuven publication type: ||IT|
|Appears in Collections:||Department of Materials Engineering - miscellaneous|
× corresponding author|
# (joint) last author|
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