Title: Materials engineering for future interconnects: catalyst-free electroless Cu deposition on self-assembled monolayer alternative barriers
Authors: Armini, Silvia ×
Maestre Caro, Arantxa #
Issue Date: 2010
Publisher: Electrochemical Society
Series Title: Journal of the Electrochemical Society vol:157 issue:1 pages:D74-D80
ISSN: 0013-4651
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Quantum Chemistry and Physical Chemistry Section
× corresponding author
# (joint) last author

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