Title: On the thermal mechanical behaviors of a novel nanowire based anisotropic conductive film technology
Authors: Cheng, Hsien-Chie ×
Chen, Wen-Hwa
Lin, Chieh-Sheng
Hsu, Yung-Yu
Uang, Ruoh-Huey #
Issue Date: May-2009
Publisher: IEEE
Series Title: IEEE Transactions on Advanced Packaging vol:32 issue:2 pages:546-563
ISSN: 1521-3323
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Department of Materials Engineering - miscellaneous
× corresponding author
# (joint) last author

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