|ITEM METADATA RECORD
|Title: ||On the thermal mechanical behaviors of a novel nanowire based anisotropic conductive film technology|
|Authors: ||Cheng, Hsien-Chie ×|
Uang, Ruoh-Huey #
|Issue Date: ||May-2009 |
|Series Title: ||IEEE Transactions on Advanced Packaging vol:32 issue:2 pages:546-563|
|Publication status: ||published|
|KU Leuven publication type: ||IT|
|Appears in Collections:||Department of Materials Engineering - miscellaneous|
× corresponding author|
# (joint) last author|
|Files in This Item:
There are no files associated with this item.
Request a copy
All items in Lirias are protected by copyright, with all rights reserved.
© Web of science