Title: Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction
Authors: Wilson, Chris ×
Zhao, Chao
Zhao, Larry
Metzger, T.H
Tokei, Zsolt
Croes, Kristof
Pantouvaki, Marianna
Beyer, Gerald
Horsfall, A.B
O Neill, A.G #
Issue Date: May-2009
Publisher: American Institute of Physics
Series Title: Applied Physics Letters vol:94 issue:18
Article number: 181914
ISSN: 0003-6951
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Department of Materials Engineering - miscellaneous
× corresponding author
# (joint) last author

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