ITEM METADATA RECORD
Title: Test structures for characterization of thermal-mechanical stress in 3D stacked IC for analog design
Authors: Minas, Nikolaos
Van der Plas, Geert
Oprins, Herman
Yang, Yu
Okoro, Chukwudi
Mercha, Abdelkarim
Torregiani, Cristina
Perry, Dan
Marchal, Pol
Rakowski, Michal
Cherman, Vladimir #
Issue Date: 2010
Host Document: Proceedings of the 23rd IEEE International Conference on Microelectronic Test Structures - ICMTS pages:140-144
Conference: 23rd IEEE International Conference on Microelectronic Test Structures - ICMTS location:Hiroshima Japan date:22-mrt-2010
ISBN: 978-1-4244-6915-4
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Electrical Engineering - miscellaneous
Production Engineering, Machine Design and Automation (PMA) Section
Associated Section of ESAT - INSYS, Integrated Systems
# (joint) last author

Files in This Item:

There are no files associated with this item.

Request a copy

 




All items in Lirias are protected by copyright, with all rights reserved.

© Web of science