Title: Electrical modeling and characterization of through silicon via for three-dimensional ICs
Authors: Katti, Guruprasad ×
Stucchi, Michele
De Meyer, Kristin
Dehaene, Wim #
Issue Date: Jan-2010
Publisher: IEEE
Series Title: IEEE Transactions on Electron Devices vol:57 issue:1 pages:256-262
ISSN: 0018-9383
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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