ITEM METADATA RECORD
Title: Copper plating for 3d interconnects
Authors: Radisic, Alex
Luhn, Ole
Vaes, Jan
Armini, Silvia
El-Mekki, Zaid
Radisic, Dunja
Ruythooren, Wouter
Vereecken, Philippe #
Issue Date: 2010
Host Document: Processing, Materials, and Integration of Damascene and 3D Interconnects pages:119-125
Conference: Processing, Materials, and Integration of Damascene and 3D Interconnects location:Vienna Austria date:4-okt-2009
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Centre for Surface Chemistry and Catalysis
# (joint) last author

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