Title: Mechanical characterization of poly-SiGe layers for CMOS-MEMS integrated application
Authors: Modlinski, Robert ×
Witvrouw, Ann
Verbist, Agnes
Puers, Robert
De Wolf, Ingrid #
Issue Date: 2010
Publisher: IOP Publishing Ltd.
Series Title: Journal of Micromechanics and Microengineering vol:20 issue:1 pages:015014-1-015014-7
Article number: 15014
Abstract: Measuring mechanical properties at the microscale is essential to understand and to fabricate
reliable MEMS. In this paper a tensile testing system and matching microscale test samples are
presented. The test samples have a dog-bone-like structure. They are designed to mimic
standard macro-tensile test samples. The micro-tensile tests are used to characterize 0.9 μm
thick polycrystalline silicon germanium (poly-SiGe) films. The poly-SiGe film, that can be
considered as a close equivalent to polycrystalline silicon (poly-Si), is studied as a very
promising material for use in CMOS/MEMS integration in a single chip due to its
low-temperature LPCVD deposition (T < 450 ◦C). The fabrication process of the poly-SiGe
micro-tensile test structure is explained in detail: the design, the processing and
post-processing, the testing and finally the results’ discussion. The poly-SiGe micro-tensile
results are also compared with nanoindentation data obtained on the same poly-SiGe films as
well as with results obtained by other research groups.
ISSN: 0960-1317
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Department of Materials Engineering - miscellaneous
ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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