Title: Fabrication techique of a compressible biocompatible interconnect
Authors: Aarts, Arno
Srivannavit, Onnop
Wise, Kensall D
Yoon, Euisik
Neves, Herc
Puers, Robert
Van Hoof, Christiaan #
Issue Date: Sep-2010
Conference: The 21st Workshop on Micromachining, Micromechanics and Microsystems edition:21 location:Enchede date:26-29 september 2010
Abstract: A compressible multifunctional interconnect
for out-of-plane MEMS structures has been
fabricated using a thin film transfer bonding technique
and bio-tolerable materials. The bulk material
of the compressible film consists of photo patternable
poly-dimethylsiloxane (PDMS) and is fabricated
on a carrier substrate. The film is bonded to a slimbase
platform. The carrier substrate of the thin film
is released using an aluminum anodic dissolution
technique. Probe arrays can be assembled perpendicular
into a slim base platform. Ones the probes
are assembled a non-separatable electrical connection
is made. This interconnect can also facilitate
fluidic probes for direct drug delivery applications.
Publication status: accepted
KU Leuven publication type: AC
Appears in Collections:ESAT - MICAS, Microelectronics and Sensors
Associated Section of ESAT - INSYS, Integrated Systems
# (joint) last author

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