Title: Direct Cu-on-Ta electroplating from ionic liquids in high vacuum
Authors: Schaltin, Stijn ×
Shkurankov, Andrey
Binnemans, Koen
Fransaer, Jan
Issue Date: 2010
Publisher: Electrochemical Society, Inc
Host Document: Electrochemical Society Transactions - ECS Transactions vol:25 issue:27 pages:119-128
Conference: 216th ECS Meeting location:Vienna (Austria) date:4-9 October 2009
Abstract: Smooth layers of 20 nm of copper have been deposited on a tantalum substrate from ionic liquids under high vacuum conditions. By electrochemical vacuum deposition (EVD) it is possible to achieve extremely low concentrations of oxygen and water, so that the tantalum electrode does not oxidize. Due to the low vapor pressure of ionic liquids, no evaporation of the electrolyte was observed in high vacuum. The wide electrochemical windows of the ionic liquids are advantageous to obtain nucleation densities up to 8x10^14 m-2 of copper on the tantalum electrode by applying a very large overpotential. Copper was deposited at potentials as negative as -3 V versus a Cu pseudoreference electrode.
ISBN: 978-1-56677-800-8
ISSN: 1938-5862
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Molecular Design and Synthesis
Surface and Interface Engineered Materials
Department of Materials Engineering - miscellaneous
× corresponding author

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