International Workshop on Thermal Investigations of ICs and Systems vol:15 pages:174-179
International Workshop on Thermal Investigations of ICs and Systems edition:15 location:Leuven date:07-09 October 2009
A one dimensional dynamic system model for an electronics cooling loop with a microchannel heat sink is developed. This model is based on the conservation of mass, momentum and energy in the various components of the flow loop. Empirical correlations are used to calculate the pressure losses and heat transfer. The model is currently able to simulate single-phase flow, but is constructed to facilitate a future transition to two-phase flow. Special attention is given to the transition from single-phase to two-phase flow. Initial single-phase validation of the model is performed using experimental data obtained from the microchannel test facility at Purdue University. Reasonable good agreement is found between the steady state results and the experimental data. Pressure losses are calculated accurately by taking into account the entrance and exit losses of the heat sink manifold.