Title: A novel mechanism of embrittlement affecting the impact reliability of Tin-based lead-free solder joints
Authors: Lambrinou, Konstantina ×
Maurissen, Wout
Limaye, Paresh
Vandevelde, Bart
Verlinden, Bert
De Wolf, Ingrid #
Issue Date: Sep-2009
Publisher: Springer
Series Title: Journal of electronic materials vol:38 issue:9 pages:1881-1895
Abstract: This work addresses a new mode of brittle failure that occurs in the bulk of tin-based lead-free solder joints, unlike the typical brittle failures that occur in the interfacial intermetallics. Brittle failures in the joint bulk result from the low-temperature ductile-to-brittle transition in the fracture behavior of beta-tin. The bulk embrittlement of these joints is discussed by referring to the results of impact tests performed on both solder joints and bulk solder specimens. The mechanism of bulk embrittlement is largely explained based on the results of a fractography study performed on the bulk joint failures using scanning electron microscopy.
ISSN: 0361-5235
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Physical Metallurgy and Materials Engineering Section (-)
Department of Materials Engineering - miscellaneous
× corresponding author
# (joint) last author

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