|ITEM METADATA RECORD
|Title: ||Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment (vol 10, pg G76, 2007)|
|Authors: ||Urbanowicz, Adam|
Baklanov, M. R
|Issue Date: ||2007 |
|Publisher: ||Electrochemical soc inc|
|Series Title: ||Electrochemical and Solid-State Letters vol:10 issue:11 pages:S7-S7|
|Publication status: ||published|
|KU Leuven publication type: ||DI|
|Appears in Collections:||Molecular Design and Synthesis|
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