Title: Damage reduction and sealing of low-k films by combined He and NH3 plasma treatment (vol 10, pg G76, 2007)
Authors: Urbanowicz, Adam
Baklanov, M. R
Heijlen, J
Travaly, Y
Cockburn, A
Issue Date: 2007
Publisher: Electrochemical soc inc
Series Title: Electrochemical and Solid-State Letters vol:10 issue:11 pages:S7-S7
ISSN: 1099-0062
Publication status: published
KU Leuven publication type: DI
Appears in Collections:Molecular Design and Synthesis

Files in This Item:

There are no files associated with this item.

Request a copy


All items in Lirias are protected by copyright, with all rights reserved.

© Web of science