Title: Leveling of microvias by electroplating for wafer-level-packaging
Authors: Lühn, Ole
Celis, Jean-Pierre
Van Hoof, Christiaan
Baert, Kasper
Ruyhooren, W. #
Issue Date: 2007
Conference: 211th Meeting of Electrochemical Society location:Chicago, US date:6-10 May 2007
Publication status: published
KU Leuven publication type: IMa
Appears in Collections:Department of Materials Engineering - miscellaneous
Chemical and Extractive Metallurgy Section (-)
Associated Section of ESAT - INSYS, Integrated Systems
Molecular Imaging and Photonics
# (joint) last author

Files in This Item:

There are no files associated with this item.


All items in Lirias are protected by copyright, with all rights reserved.