|ITEM METADATA RECORD
|Title: ||Reducing the electrodeposition time for filling microvias with copper for 3D technology|
|Authors: ||Lühn, Ole|
Van Hoof, C.
Celis, Jean-Pierre #
|Issue Date: ||2008 |
|Host Document: ||Proc. ECTC 2008, 58th Electronic Components and Technology Conference pages:866-870|
|Conference: ||58th Electronic Components and Technology Conference location:Lake Buena Vista, Florida, US date:27-30 May 2008|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Chemical and Extractive Metallurgy Section (-)|
| ||These files are only available to some KU Leuven Association staff members|
All items in Lirias are protected by copyright, with all rights reserved.
© Web of science