Title: Reducing the electrodeposition time for filling microvias with copper for 3D technology
Authors: Lühn, Ole
Radisic, A.
Vereecken, P.M.
Swinnen, B.
Van Hoof, C.
Ruythooren, W.
Celis, Jean-Pierre #
Issue Date: 2008
Publisher: IEEE
Host Document: Proc. ECTC 2008, 58th Electronic Components and Technology Conference pages:866-870
Conference: 58th Electronic Components and Technology Conference location:Lake Buena Vista, Florida, US date:27-30 May 2008
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Chemical and Extractive Metallurgy Section (-)
# (joint) last author

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