Title: Above-IC interconnects for high-speed digital integrated circuits
Authors: Balachandran, Jayaprakash
Issue Date: 5-Jul-2007
Publication status: published
KU Leuven publication type: TH
Appears in Collections:ESAT- TELEMIC, Telecommunications and Microwaves
Associated Section of ESAT - INSYS, Integrated Systems
Electrical Engineering - miscellaneous

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