Title: Deep etching of glass wafers using sputtered molybdenum masks
Authors: Ceyssens, Frederik ×
Puers, Robert #
Issue Date: Jun-2009
Publisher: IOP Publishing Ltd.
Series Title: Journal of Micromechanics and Microengineering vol:19 issue:6
Article number: 067001
Abstract: This note presents a simple, low-cost technology to fabricate very deep isotropically etched features in glass wafers. A process based on fast etching glass combined with a stress-optimized molybdenum mask layer and a photoresist was found to be very suitable for such purposes. The obtained performance, up to 1.2 mm deep etching, rivals the best existing techniques while being more cost-competitive and using widely available equipment.
ISSN: 0960-1317
Publication status: published
KU Leuven publication type: IT
Appears in Collections:ESAT - MICAS, Microelectronics and Sensors
× corresponding author
# (joint) last author

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