Title: Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked Circuit structures
Authors: Yang, Yu ×
Bender, Hugo
Arstila, Kai
Swinnen, Bart
Verlinden, Bert
De Wolf, Ingrid #
Issue Date: Aug-2008
Series Title: Microelectronics Reliability vol:48 issue:8-9 pages:1517-1520
Abstract: Focused ion beam (FIB) and nano-probing were applied for failure analysis of three-dimensional stacked Circuits with copper through-silicon-vias between the stacked chips. The failure analysis was done after high temperature storage and thermal cycling tests. Passive voltage contrast in FIB allowed to pinpoint the open sites. FIB cross-sections showed the presence of opens at the bottom of the copper vias. The failure cause was suspected to be an interlayer particle, which was confirmed by optical profilometry. Nanoprobing was used on another sample to pinpoint the failure location through the measurement of the local resistance within the daisy chains. The failure was traced out to be related with surface contamination. (C) 2008 Elsevier Ltd. All rights reserved.
ISSN: 0026-2714
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Physical Metallurgy and Materials Engineering Section (-)
Division of Mechatronics, Biostatistics and Sensors (MeBioS)
Department of Materials Engineering - miscellaneous
× corresponding author
# (joint) last author

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