Title: Filling of microvia with an aspect ratio of 5 by copper electrodeposition
Authors: Lühn, Ole ×
Van Hoof, Christiaan
Ruythooren, Wouter
Celis, Jean-Pierre #
Issue Date: Mar-2009
Publisher: Elsevier
Series Title: Electrochimica Acta vol:54 issue:9 pages:2504-2508
Abstract: The filling of microvias with a diameter of 5 mu m and a depth of 25 mu m (aspect ratio of 5) by copper electroplating was investigated. Filling experiments were evaluated by analyzing cross-sections of filled vias with scanning electron microscopy and focused ion beam. The fill-up evolution shows a bottom-up mechanism, also known as superfilling mechanism. The evolution of potential with time (chronopotentiometric measurements) was recorded during the fill-up process of vias and is interpreted based on potentiodynamic polarization measurements.
ISSN: 0013-4686
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Associated Section of ESAT - INSYS, Integrated Systems
Chemical and Extractive Metallurgy Section (-)
× corresponding author
# (joint) last author

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