Title: Changing superfilling mode for copper electrodeposition in blind holes from differential inhibition to differential acceleration
Authors: Lühn, Ole ×
Radisic, A.
Vereecken, P.M.
Van Hoof, C.
Ruythooren, W.
Celis, Jean-Pierre #
Issue Date: 2009
Publisher: The Electrochemical Society
Series Title: Electrochemical and Solid-State Letters vol:12 issue:5 pages:D39-D41
Abstract: Blind holes 5 mu m diam and 25 mu m in depth were filled with electrodeposited copper. Before electrodeposition, the blind holes were fully metallized with a copper seed layer or with a thin sputtered Ta layer deposited on top of the copper seed layer. Filling of partially Ta-capped features was three times faster than filling fully metallized features. For fully metallized features, the growth mode for copper electrodeposition is dominated by diffusion adsorption of a leveling agent. For partially Ta-capped surfaces, the growth mode was modified to differential acceleration through accumulation of an accelerating species at the bottom of features.
ISSN: 1099-0062
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Chemical and Extractive Metallurgy Section (-)
× corresponding author
# (joint) last author

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