Title: Microactuation utilizing wafer-level integrated SMA wires
Authors: Clausi, Donato ×
Gradin, H
Braun, S
Peirs, Jan
Stemme, G
Reynaerts, Dominiek
van der Wijngaart, W #
Issue Date: Jan-2009
Publisher: The Printing House, Inc.
Host Document: 22nd IEEE International Conference on Micro Electro Mechanical Systems pages:1067-1070
Conference: 22nd IEEE International Conference on Micro Electro Mechanical systems edition:22 location:Sorrento, Italy date:25-29 January 2009
Article number: 0665
Abstract: This paper reports on the wafer-scale integration of pre-strained SMA wires to microstructured silicon devices and the performance of the microactuator prototypes.
The overall goal is to obtain low cost microactuators having high work densities and a mass production compatible manufacturing, without having to deal with the inherently high costs of a pick-and-place approach or with the complex composition control and annealing process of sputtered NiTi films.
Testing above the SMA transformation temperature shows repeatability in actuation of the fabricated structures, with net strokes of 170 µm for the double cantilever actuators.
ISBN: 978-1-4244-2978-3
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Production Engineering, Machine Design and Automation (PMA) Section
× corresponding author
# (joint) last author

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