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Title: Thermal challenges in next-generation electronic systems
Authors: Garimella, SV ×
Fleischer, AS
Murthy, JY
Keshavarzi, A
Prasher, R
Patel, C
Bhavnani, S
Venkatasubramanian, R
Mahajan, R
Joshi, Y
Sammakia, B
Myers, BA
Chorosinski, L
Baelmans, Martine
Sathyamurthy, P
Raad, P #
Issue Date: Dec-2008
Publisher: IEEE-Inst Electrical Electronics Engineering INC
Series Title: IEEE Transactions on Component and Packaging Technologies vol:31 issue:4 pages:801-815
Abstract: Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.
ISSN: 1521-3331
Publication status: published
KU Leuven publication type: IT
Appears in Collections:Applied Mechanics and Energy Conversion Section
× corresponding author
# (joint) last author

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