Thermal Challenges in Next-Generation Electronic Systems

Garimella, SV; Fleischer, AS; Murthy, JY; Keshavarzi, A; Prasher, R; Patel, C; Bhavnani, S; Venkatasubramanian, R; Mahajan, R; Joshi, Y; Sammakia, B; Myers, BA; Chorosinski, L; Baelmans, Martine; Sathyamurthy, P; Raad, P

doi:10.1109/TCAPT.2008.2001197

Thermal Challenges in Next-Generation Electronic Systems

Author:

Garimella, SV

Fleischer, AS ; Murthy, JY ; Keshavarzi, A ; Prasher, R ; Patel, C ; Bhavnani, S ; Venkatasubramanian, R ; Mahajan, R ; Joshi, Y ; Sammakia, B ; Myers, BA ; Chorosinski, L ; Baelmans, Martine ; Sathyamurthy, P ; Raad, P

Keywords:

Electronics cooling, Thermal management, Trends, Science & Technology, Technology, Engineering, Manufacturing, Engineering, Electrical & Electronic, Materials Science, Multidisciplinary, Engineering, Materials Science, thermal management, trends, thermal design and fluid engineering, 0906 Electrical and Electronic Engineering, 0910 Manufacturing Engineering, Electrical & Electronic Engineering

Abstract:

Thermal challenges in next-generation electronic systems, as identified through panel presentations and ensuing discussions at the workshop, Thermal Challenges in Next Generation Electronic Systems, held in Santa Fe, NM, January 7-10, 2007, are summarized in this paper. Diverse topics are covered, including electrothermal and multiphysics codesign of electronics, new and nanostructured materials, high heat flux thermal management, site-specific thermal management, thermal design of next-generation data centers, thermal challenges for military, automotive, and harsh environment electronic systems, progress and challenges in software tools, and advances in measurement and characterization. Barriers to further progress in each area that require the attention of the research community are identified.