Title: Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM
Authors: Okoro, Chukwudi
Jourdain, A
Vandevelde, B
Swinnen, B
Vandepitte, Dirk #
Issue Date: Apr-2008
Conference: Eurosime 2008 location:Freiburg, Germany date:Apr 20-21, 2008
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Production Engineering, Machine Design and Automation (PMA) Section
# (joint) last author

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