|ITEM METADATA RECORD
|Title: ||Characterization of interconnects resulting from capillary die-to-substrate self-assembly|
|Authors: ||Mastrangeli, M.|
Van Hoof, C.
Celis, Jean-Pierre #
|Issue Date: ||2008 |
|Host Document: ||Proc. ESTC-2008, 2nd Electronics Systemintegration Technology Conference pages:135-140|
|Conference: ||ESTC-2008, Electronics Systemintegration Technology Conference edition:2 location:Greenwich, London, UK date:1-4 September 2008|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Chemical and Extractive Metallurgy Section (-)|
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