|ITEM METADATA RECORD
|Title: ||Effect of the intermetallic particle size on the brittle to ductile fracture transition in a bulk Sn-4wt%Ag-0.5wt%Cu solder|
|Authors: ||Ratchev, P.|
Verlinden, Bert #
|Issue Date: ||2005 |
|Publisher: ||IPC Association Connecting Electronic Industries, Bannockburn, IL, USA|
|Host Document: ||Proc. 10th International Conference on Lead Free Electronic Components and Assemblies (IPC/JEDEC)|
|Conference: ||10th International Conference on Lead Free Electronic Components and Assemblies (IPC/JEDEC) date:2005|
|Article number: ||Paper No. 4 (no pages)|
|Publication status: ||published|
|KU Leuven publication type: ||IC|
|Appears in Collections:||Physical Metallurgy and Materials Engineering Section (-)|
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