ITEM METADATA RECORD
Title: Effect of the intermetallic particle size on the brittle to ductile fracture transition in a bulk Sn-4wt%Ag-0.5wt%Cu solder
Authors: Ratchev, P.
Vandevelde, B.
Verlinden, Bert #
Issue Date: 2005
Publisher: IPC Association Connecting Electronic Industries, Bannockburn, IL, USA
Host Document: Proc. 10th International Conference on Lead Free Electronic Components and Assemblies (IPC/JEDEC)
Conference: 10th International Conference on Lead Free Electronic Components and Assemblies (IPC/JEDEC) date:2005
Article number: Paper No. 4 (no pages)
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Physical Metallurgy and Materials Engineering Section (-)
# (joint) last author

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