Title: Investigation of the influence of UBM on lead free flip chip solder fatigue life by finite element modeling of intermetallic layers
Authors: Limaye, P.
Vandevelde, B.
Labie, R.
Ratchev, P.
Beyne, E.
Vandepitte, Dirk
Verlinden, Bert #
Issue Date: 2005
Host Document: Proc. EMPC 2005 (IMAPS-Europe) pages:253-258
Conference: EMPC 2005 (IMAPS-Europe) date:2005
Publication status: published
KU Leuven publication type: IC
Appears in Collections:Physical Metallurgy and Materials Engineering Section (-)
Production Engineering, Machine Design and Automation (PMA) Section
# (joint) last author

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